Study on the thermal conductivity of diamond-like carbon functionally graded material on copper substrate

	Study on the thermal conductivity of diamond-like carbon functionally graded material on copper substrate
	Wang Jing 1; Liu Gui-Chang 2; Li Hong-Ling 1; Hou Bao-Rong 1; Wang, J (reprint author), Chinese Acad Sci, Inst Oceanol, Key Lab Oratory Corros Sci, Qingdao 266071, Peoples R China.
	2012-03-01
发表期刊	ACTA PHYSICA SINICA
ISSN	1000-3290
卷号	61 期号:5 页码:58102
文章类型	Article
摘要	In recent years, with the rapid development of electronic technology and digital network information, copper has increasing applications in micro-electronics, micro-electro-mechanical systems and Hi-tech materials. However copper has its material limitations. In particular, it has relatively low hardness, high oxidation and wear rate, which have severely restricted its widespread applications. In this paper, aiming at difficulties of copper applications, Ti/TiC/DLC has been proposed as functionally graded material to deposit on the copper substrate with plasma depositing method, which intensifies the adhesion between DLC film and copper substrate and improves the properties of copper. The maximal value of thermal conductivity of DLC film with optimized parameter of graded intermediate layer is 3.63 Wm(-1).K-1, which enhances the heat transfer effect of copper substrate.
关键词	Copper Substrate Diamond-like Carbon Graded Intermediate Layer Thermal Conductivity
学科领域	Physics, Multidisciplinary
收录类别	SCI
语种	英语
WOS记录号	WOS:000303170800068
引用统计	被引频次：3[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.qdio.ac.cn/handle/337002/12482
专题	海洋环境腐蚀与生物污损重点实验室
通讯作者	Wang, J (reprint author), Chinese Acad Sci, Inst Oceanol, Key Lab Oratory Corros Sci, Qingdao 266071, Peoples R China.
作者单位	1.Chinese Acad Sci, Inst Oceanol, Key Lab Oratory Corros Sci, Qingdao 266071, Peoples R China 2.Dalian Univ Technol, Sch Chem Engn, Fac Chem Environm & Biol Sci & Technol, Dalian 116024, Peoples R China
第一作者单位	中国科学院海洋研究所
推荐引用方式 GB/T 7714	Wang Jing,Liu Gui-Chang,Li Hong-Ling,et al. Study on the thermal conductivity of diamond-like carbon functionally graded material on copper substrate[J]. ACTA PHYSICA SINICA,2012,61(5):58102.
APA	Wang Jing,Liu Gui-Chang,Li Hong-Ling,Hou Bao-Rong,&Wang, J .(2012).Study on the thermal conductivity of diamond-like carbon functionally graded material on copper substrate.ACTA PHYSICA SINICA,61(5),58102.
MLA	Wang Jing,et al."Study on the thermal conductivity of diamond-like carbon functionally graded material on copper substrate".ACTA PHYSICA SINICA 61.5(2012):58102.

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