Extreme wettability due to dendritic copper nanostructure via electrodeposition

doi:10.1016/j.apsusc.2011.04.126

	Extreme wettability due to dendritic copper nanostructure via electrodeposition
	Wang, Peng 1; Zhang, Dun 1; Qiu, Ri 1,2; Zhang, D (reprint author), Chinese Acad Sci, Inst Oceanol, Shandong Prov Key Lab Corros Sci, 7 Naihai Rd, Qingdao 266071, Peoples R China
	2011-08-01
发表期刊	APPLIED SURFACE SCIENCE
ISSN	0169-4332
卷号	257 期号:20 页码:8438-8442
文章类型	Article
摘要	Dendritic copper film with convertible extreme wettability is prepared on metal surface via electrodeposition. With field emission scanning electron microscopy (FESEM), X-ray diffraction (XRD) and electrochemical measurement, the morphology, composition and formation mechanism of dendritic copper film were studied. It is found that the film is mainly composed of metallic copper. Also some residual cuprous oxide and chloride exist in the deposit. The single micron-sized dendrite consists of a main stem with side branches, on which the higher-order branches with the dimension of tens of nanometers grow. A hydrophobic modification can induce the conversion of the apparent wettability of film from super-hydrophilicity (with apparent water contact angle of 5 +/- 3 degrees) to super-hydrophobicity (with apparent water contact angle of 154.1 +/- 3 degrees), which is due to the capillary effect. The method proposed in this paper is time-saving and facile to operate, and it offers a promising technique to prepare metallic surface with a high wettability contrast for water. (C) 2011 Elsevier B. V. All rights reserved.; Dendritic copper film with convertible extreme wettability is prepared on metal surface via electrodeposition. With field emission scanning electron microscopy (FESEM), X-ray diffraction (XRD) and electrochemical measurement, the morphology, composition and formation mechanism of dendritic copper film were studied. It is found that the film is mainly composed of metallic copper. Also some residual cuprous oxide and chloride exist in the deposit. The single micron-sized dendrite consists of a main stem with side branches, on which the higher-order branches with the dimension of tens of nanometers grow. A hydrophobic modification can induce the conversion of the apparent wettability of film from super-hydrophilicity (with apparent water contact angle of 5 +/- 3 degrees) to super-hydrophobicity (with apparent water contact angle of 154.1 +/- 3 degrees), which is due to the capillary effect. The method proposed in this paper is time-saving and facile to operate, and it offers a promising technique to prepare metallic surface with a high wettability contrast for water. (C) 2011 Elsevier B. V. All rights reserved.
关键词	Electrodeposition Super-hydrophobicity Super-hydrophilicity Dendritic Copper
学科领域	Chemistry ; Materials Science ; Physics
DOI	10.1016/j.apsusc.2011.04.126
URL	查看原文
收录类别	SCI
语种	英语
WOS记录号	WOS:000291725100024
引用统计	被引频次：31[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.qdio.ac.cn/handle/337002/11445
专题	海洋环境腐蚀与生物污损重点实验室
通讯作者	Zhang, D (reprint author), Chinese Acad Sci, Inst Oceanol, Shandong Prov Key Lab Corros Sci, 7 Naihai Rd, Qingdao 266071, Peoples R China
作者单位	1.Chinese Acad Sci, Inst Oceanol, Shandong Prov Key Lab Corros Sci, Qingdao 266071, Peoples R China 2.Chinese Acad Sci, Grad Sch, Beijing 100039, Peoples R China
第一作者单位	中国科学院海洋研究所
推荐引用方式 GB/T 7714	Wang, Peng,Zhang, Dun,Qiu, Ri,et al. Extreme wettability due to dendritic copper nanostructure via electrodeposition[J]. APPLIED SURFACE SCIENCE,2011,257(20):8438-8442.
APA	Wang, Peng,Zhang, Dun,Qiu, Ri,&Zhang, D .(2011).Extreme wettability due to dendritic copper nanostructure via electrodeposition.APPLIED SURFACE SCIENCE,257(20),8438-8442.
MLA	Wang, Peng,et al."Extreme wettability due to dendritic copper nanostructure via electrodeposition".APPLIED SURFACE SCIENCE 257.20(2011):8438-8442.

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